| Type |
Purity |
Thickness |
Deposit |
Applications |
Bright |
99% purity |
.000002” - .000015” normal range of thickness |
Good solderablility.
Bright,
Hard
|
As a final plate or underplate where high reflectivity and wear-resistance are desired,
Used as a barrier layer to prevent copper migration at high temperatures or with thin decorative gold
|
Low stress dull (sulfamate) |
99.9% purity |
.000015” normal range of thickness |
Very good solderability,
No offgassing at high temperatures,
Excellent ductility yet hard and wear-resistant
|
Used as fine-grained underplate for wire-bonding gold,
Electroforms up to .020”
|
